
Modeling and Simulation for Microelectronic Packaging Assembly : Manufacturing, Reliability and Testing
Innbundet
I salg
Leveringstid: 7-30 dager
Handlinger
Beskrivelse
Omtale
An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.
Detaljer
-
Utgivelsesdato:
21.10.2011
-
ISBN:
9780470827802
-
Språk:
, Engelsk
-
Forlag:
John Wiley & Sons Inc -
Fagtema:
-
Litteraturtype:
-
Sider:
576
-
Høyde:
25.2 cm
-
Bredde:
17.5 cm

