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Modeling and Simulation for Microelectronic Packaging Assembly : Manufacturing, Reliability and Testing

Liu, Shen Liu, Yong

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Leveringstid: 7-30 dager

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Omtale

An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.

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